Pace TF2800 BGA / SMD työasema kuumailmalla
62205,00 € ALV 0%
- Precision 24″ x 24″ PCB Holder
- Ultra-Precise 28µm Placement Accuracy
- Adjustable Height Bottom-Side IR Preheater
- Single-Axis Operation
- Motorized, High-Def (1080p) Optical Alignment System with Quad-Field Imaging
- Revolutionary Inductive-Convection Heater
Kuvaus
Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.
Enter PACE’s TF 2800 BGA/SMD Rework System. With its groundbreaking, patent-pending Inductive-Convection Heating Technology, the TF 2800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.
Koodi: 8007-0583
