Pace TF2800 BGA / SMD työasema kuumailmalla

49000,00  ALV 0%

  • Precision 24″ x 24″ PCB Holder
  • Ultra-Precise 28µm Placement Accuracy
  • Adjustable Height Bottom-Side IR Preheater
  • Single-Axis Operation
  • Motorized, High-Def (1080p) Optical Alignment System with Quad-Field Imaging
  • Revolutionary Inductive-Convection Heater

Kuvaus

TF2800 BGA and SMD Rework System

Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.

Enter PACE’s TF 2800 BGA/SMD Rework System. With its groundbreaking, patent-pending Inductive-Convection Heating Technology, the TF 2800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.